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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA112B/2SGM-PF DATA SHEET DOC. NO : REV. DATE : : QW0905-LA112B/2SGM-PF A 15 - Apr. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA112B/2SGM-PF Page 1/5 Package Dimensions 4.3 2.50.5 O3.2*2 8.2 SGM 5.0 O2.9*2 2.9 9.6 SGM 2.65 0.5 TYP 3.20.3 4.450.5 2.54TYP + - 6.990.5 LSGM2640-1 2.9 3.1 3.3 1.5 MAX 4.3 25.0MIN 0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA112B/2SGM-PF Page 2/5 Absolute Maximum Ratings at Ta=25 Ratings Parameter Symbol SGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 100 50 1000 -20 ~ +80 -30 ~ +100 mA mA mW UNIT A V Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded. Typical Electrical & Optical Characteristics (Ta=25 ) COLOR PART NO MATERIAL Emitted LA112B/2SGM-PF Luminous Peak Dominant Spectral Forward wave intensity wave halfwidth voltage length length nm @20mA(V) @20mA(mcd) P nm D nm Viewing angle 2 1/2 (deg) Lens Green Diffused Typ. Max. Min. Typ. 518 525 35 3.5 4.2 550 900 50 InGaN/SiC Green Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA112B/2SGM-PF Page 3/5 Typical Electro-Optical Characteristics Curve SGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Forward Current vs. Relative Intensity 2.5 30 Forward Current(mA) Forward Current(mA) 1.0 2.0 1.5 1.0 0.5 0.0 20 10 0 1.5 2.0 2.5 3.0 3.5 4.0 0 10 20 30 40 50 Forward Voltage(V) Fig.3 Forward Current vs. Temperature 60 50 40 30 20 10 0 0 20 40 60 80 100 Relative Intensity Normalize @20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 Forward Current@20mA 2.0 1.5 1.0 0.5 0.0 20 30 40 50 60 70 Ambient Temperature() Ambient Temperature() Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA112B/2SGM-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp( C) 260 C3sec Max 260 5 /sec max 120 2 /sec max 25 0 0 Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA112B/2SGM-PF Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=1055 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-405 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=655 2.RH=90%~95% 3.t=240hrs2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=1055&-405 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=2605 2.Dwell time= 101sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=2305 2.Dwell time=51sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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